Understanding the factors affecting the formation of a high quality interface between copper and diamond
Abstract
The quality of the interface between copper and diamond significantly affects the thermal-physical properties of copper/diamond composites, which show promise as advanced heat sink materials in high-power electronic devices. This research will develop copper/diamond composites with a high-quality interface through a novel and rapid method combining high energy mechanical milling (HEMM) and thermal powder consolidation (TPC) techniques, using fine copper, low-cost artificial diamond powders and a small amount of metal additives. The microstructural evolution and factors affecting copper/diamond interface formation during HEMM and TPC will be explored, and the effects of interface morphologies, chemical compositions, and phase constitutions on the thermal-physical properties of copper/diamond materials will also be investigated. Through the research, the process-microstructure-property relationship of the copper/diamond composite will be identified and advanced heat sink materials will be also created. These materials will have the potential to dissipate the heat generated by electronic circuits 2-3 times faster than existing heat sink materials. Our research into the copper/diamond interface formation and its affecting factors will advance understanding in fundamental interface science, enabling increased control over interface quality through the optimization of processing methods, and overcome the technical challenges for producing composites with high thermal conductivity.
Document Details
- Document Type
- DoD Grant Award
- Publication Date
- Jul 28, 2017
- Source ID
- FA23861714025
Entities
People
- Fei Yang
Organizations
- Air Force Office of Scientific Research
- United States Air Force
- University of Waikato