A Designer Fluid for Aluminum Phase Change Devices
Abstract
HENDERSON, KYLE; AFRL/RVKVS, FOA-RVKV-2013-0001; 4. SPACE PLATFORMS & OPERATIONS TECH Abstract Research Objective The importance of phase change heat transfer devices and the motivation behind extending the compatibility of water as a working fluid in aluminum is addressed. Though water is widely used with copper, aluminum/water devices are not achievable in spite of the reduced weight and cost of the material. The obstacle in combining aqueous working fluids and aluminum in a phase change device is the creation of non-condensable gas (NCG) which leads to rapid failure. It is proposed to develop an inorganic aqueous solution for use in aluminum heat pipes. The objective of the proposed study is to provide the fundamental knowledge of electrochemistry and thermodynamics needed to obtain a reliable aluminum/water device. Technical Approach Chemical reactions responsible for passivating the device material and preventing generation of NCG will be explained. Species concentrations in solution will be explored to ensure long-term passivation under a variety of operating conditions. An understanding of the relation between species concentrations and the resulting surface chemistry will be obtained. Lifetime tests will confirm reliability. Anticipated Outcome and Impact The proposed research will enable engineers to use water in applications heretofore not possible. A better understanding of the role of electrochemistry and thermodynamics in corrosion protection will be developed. The results will yield needed information to enhance the performance of electronic devices ranging from cell phones to high power density devices. The weight savings is accompanied by a significant reduction in material costs. Public Purpose Advances in consumer electronics has necessitated the integration of high performance thermal management only previously needed in power electronics in advanced applications. Many computers, cell phones, LED’s, and batteries at the consumer level have reached thermal design bottlenecks. Increasing the performance of commonly used heat pipes would allow for the continued advances in consumer electronics with longer product lifetimes.
Document Details
- Document Type
- DoD Grant Award
- Publication Date
- Jul 18, 2016
- Source ID
- FA94531510318
Entities
People
- Ivan Catton
Organizations
- Air Force Research Laboratory
- United States Air Force
- University of California, Los Angeles