Laser integration on silicon photonic circuits through transfer printing
Abstract
Laser integration is the holy grail for silicon photonic integrated circuits. There is a need for a radically new integration approach that in an efficient way can integrate (deep) sub millimeter size coupons of III-V material in a recess on an advanced silicon photonics wafer. In this project we will explore a novel integration method based on the the transfer printing of III-V material onto Si.
Document Details
- Document Type
- DoD Grant Award
- Publication Date
- Mar 23, 2016
- Source ID
- FA95501510460
Entities
People
- Günther Roelkens
Organizations
- Air Force Office of Scientific Research
- Ghent University
- United States Air Force