Photonic Integrated Circuit co-Packaging and Integration Center (PIC)2
Abstract
This proposal will establish a stand-alone capability for the co-packaging and integration of photonic integrated circuits (PICs) by acquiring a photonic-wire-bonding (PWB) system. The goal is to enable the integration of various PICs that consist of different material systems, e.g., silicon, silicon-nitride, III-V’s, and thin-film-lithium-niobate (TFLN). The silicon and silicon-nitride PICs will be manufactured through the AIM Photonics Institute, or comparable foundry. Alternate PICs will be made at commercial and private foundries for using III-V’s and TFLN materials. The emphasis of this project will be on the heterogeneous integration of silicon-silicon nitride PICs with materials and devices that offer enhanced electro-optic functionality, such as TFLN. This work is motivated, in part, by the perpetual demand for high-frequency and high-bandwidth radio-frequency (RF) systems that are being driven by the perpetual growth in 5G-6G technologies as well as emerging DoD applications. The realization of this capability is predicated on the acquisition of a PWB system, from vendors such as Vanguard Automation, to realize a PIC co-packaging and integration center at the University of Delaware, which will establish a unique manufacturing capability unique within the continental United States (CONUS).
Document Details
- Document Type
- DoD Grant Award
- Publication Date
- Mar 07, 2024
- Source ID
- FA95502310595
Entities
People
- Dennis W. Prather
Organizations
- Air Force Office of Scientific Research
- United States Air Force
- University of Delaware