A Research Center for Radiation Effects Reliability Mechanisms Unique to 3D Integration.
Abstract
Three-dimensional (3D) integration of electronic, optical, and electro-mechanical functions is being adopted by industry to continue to improve performance-to-power ratios and gain smaller physical footprints. These attributes are advantageous for space and defense applications. While significant efforts exist in development and integration of constituent technologies, very little work has been done to understand radiation-related reliability issues that are specific to the 3D implementations. The proposed research will use advanced simulation and novel experimental techniques to investigate the unique radiation-effects considerations related to the geometries and materials used in 3D integrated technologies. The project will bring together world-leading research and development groups in the areas of 3D technologies, testing, and design, and apply extensive expertise in radiation-effects mechanisms, modeling, and testing to advance the understanding of radiation-effects reliability issues associated with in 3D integration. The understanding of mechanisms, manifestations and approaches to test and analyze radiation effects in 3D ICs, are the anticipated outcomes of the proposed research
Document Details
- Document Type
- DoD Grant Award
- Publication Date
- Jan 23, 2018
- Source ID
- HDTRA11810002
Entities
People
- Mike Alles
Organizations
- Defense Threat Reduction Agency
- Vanderbilt University