Heterogeneous Integration with Thermal Management for Miniaturized RF Front Ends
Abstract
Heterogeneous Integration with Thermal Management for Miniaturized RF Front EndsShort SOWFunds are provided to investigate diverse heterogeneous integrated electronic components. The PI is Prof. Zoya Popovic, the performer is the University of Colorado at Boulder.This is a 16 month effort fully funded with $115K.This grant will investigate the benefits of a novel packaging technology called ITAP (Integrated Thermal Array Plate) developed by HRL in the DAHI program to overcome conventional thermal limits for several RF and electronic circuits to be combined heterogeneously. The ITAP packaging approach utilizes an electroformed void-free solid Cu heat sink on the top side of several chips of different geometries (thicknesses, flatness, interconnect types, etc.) Using the ITAP packaging and integration technology, we will showcase improved efficiencies, functionalities and signal bandwidths due to the combination of best suited technology chips integrated in a small footprint while maintaining excellent thermal heat transfer for the individual chips. Several components will be designed using multiple circuits, with as many as possible fabricated, depending on HRL~s schedule.ObjectiveInvestigate and demonstrate the benefits of a novel electroformed void-free solid Cu heat sink packaging technology called ITAP (Integrated Thermal Array Plate) developed by HRL in the DAHI program to overcome conventional thermal limits for several RF and electronic circuits to be combined heterogeneously in the same package.ApproachMultiple circuits realized in diverse technologies will be combined in the ITAP packaging approach with an electroformed void-free solid Cu heat sink on the top side of several chips of different geometries (thicknesses, flatness, interconnect types, etc.) the planned circuit types include a GaN envelope tracking power amplifier with supply modulator, high-efficiency linear PA including harmonic injection at the output, along with DAC~s, mixers, and phase shifters. In addition to the electroformed heatsink, lithographically defined interconnects on the back side of the chips with be incorporated so that bond-wires are eliminated in order to achieve high signal bandwidth.The resulting integrated package will be test to demonstrate functionality, improved thermal management, reduced interconnect parasitics and improved performance compared totraditionally packaged devices.Specifically for each component:-Envelop tracking PAs ~ improved efficiency with larger signal bandwidths-Harmonic injection PA ~ improved linearity and efficiency over harmonically-terminated PAs with DPD-Lower junction temperatures ~ operate device at higher voltages without failure-All circuits: reduced size and temperature, reduced parasiticsMission and MeritThis program will showcase the integration of several different technologies in a single thermally managed package, which is an enabling technology for miniaturized and improved front ends for communications and radar. The proposed components showcase a more compact, more thermally efficient integration of electronically efficient devices using wide bandgap materials, which leads to a reduction of the cost, weight and size of transmit and receive systems. This technology will also further increase the performance of active aperture phased arrays capable of performing multiple functions simultaneously, since the RF-part can be integrated in a more compact fashion while enhancing the thermal management, which is especially crucial in an array where the spacing between the elements and therefore the T/R modules should be small to achieve a good antenna performance.
Document Details
- Document Type
- DoD Grant Award
- Publication Date
- Sep 23, 2016
- Source ID
- N000141613160
Entities
People
- Zoya Popovic
Organizations
- Office of Naval Research
- Regents of the University of Colorado
- United States Navy