Heterogeneous cryogenic superconducting integrated systems assembled on the Silicon Interconnect Fabric with external analog and optical interconnects
Abstract
UCLA proposes to design and build a proof of concept prototype integrated superconducting electronic system. The system consists of a superconducting Silicon Interconnect Fabric that leverages the work of Lincoln Labs and integrates superconducting test dies with an impedance transformer chip made of quartz and a photonics IC. THz range analog signals may be received across the cryo boundary, processed and optically modulated signals may be transmitted across the boundary separating the cryogenic part of the system from the room temperature part. The design will be based on extensive High frequency simulation. the work proposed here will enable DoD systems to take advantage of the latest high-performance packaging technology for both analog and digital systems.
Document Details
- Document Type
- DoD Grant Award
- Publication Date
- Jul 27, 2018
- Source ID
- N000141812638
Entities
People
- Subramanian Iyer
Organizations
- Office of Naval Research
- United States Navy
- University of California, Los Angeles