Topology optimization and additive manufacturing of heat sinks for single-phase and two-phase electronic cooling

Abstract

Task 1: Topological optimization of heat sinks with single-phase liquid cooling under laminar flow.- develop physical insights into the effects of thermal conductivity on optimized fin shapes and topology, the trade-offs between the straight fin shapes vs optimized freeform fin shapes and potential secondary and tertiary fins, and the coupling effects between thermal conductivity and liquid convection on heat dissipationTask 2: Topological optimization of heat sinks with single-phase liquid cooling under turbulent flow - extend the coupled thermos fluid topology optimization to turbulent flowsTask 3: Topology optimization of heat sinks with two-phase cooling (2D) - 2D optimization of heat sinks with two-phase cooling where the goal is to gain insight of the physics and the interplay of heat sink geometry/topology and its heat dissipation capacity.Task 4: Topology optimization of heat sinks with two-phase cooling (3D) - extend Task 3 from 2D heat sink optimization to optimization of 3D heat sinks with two-phase liquid/vapor cooling.Task 5: Additive manufacturing of optimized heat sinks - fabricate various optimized designs from Task 1 to Task 4, with different conductive materials, ranging from copper, aluminum to thermoplastics with highly conductive filaments. Task 6: Experimental testing of heat dissipation - experimentally characterize heat dissipation capacity of various fabricated heat sinks from Task 5 with single and two-phase fluids.

Document Details

Document Type
DoD Grant Award
Publication Date
Jul 27, 2018
Source ID
N000141812685

Entities

People

  • Xiaoping Qian

Organizations

  • Office of Naval Research
  • United States Navy
  • University of Wisconsin System

Tags

Readers

  • Combustion and Flow Dynamics.
  • Distributed Systems and Data Platform Development
  • Thermal Physics or Thermal Science.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene