High Temperature Organic Semiconductors.
Abstract
This project aims to develop thermally-stable high temperature organicsemiconductors, to understand the impact of thermal energy on charge generation and transport in their thin films, and to ultimately achieve morphologically- and electronically-stable high performance printed electronic devices at elevated temperatures. During the previous project supported by ONR to explore melt-processable organic semiconductors, it is found that theelectronic properties and thin film morphologies of semiconducting polymers are highly temperature-dependent, and thus the performance of their thin film electronics becomes unstable at elevated temperatures. Similarly, the performance of conventional inorganic semiconductors issharply deteriorated at elevated temperatures (i.e. >85 ~C ) due to junction leakages and reducedcharge carrier mobility, which limits their operation temperatures. In the current project, wepropose a general approach to achieve thermally-stable high temperature semiconducting polymer blends that can withstand extreme temperatures, comparable or superior to current military grade (-50 to 125 ~C) inorganic electronics. The proposed high temperature semiconducting polymer blends feature an interpenetrating network of semicrystalline conjugated polymers and high glass transition temperature (Tg) host polymers, in which conjugated polymer chains are confined at elevated temperatures. In the phase I of the project, we will establish the design criteria for semiconducting polymers blends that demonstrate the characteristics of a temperature-independent charge transport behavior and function stably at elevated temperatures. Phase II deals with the understanding of thin film formation, the impact of thermal energy on microstructures, as well as charge generation and transport in the blend thin films. Phase III will culminate with the demonstration of thermally-stable printed electronics that meet military standards with high level of reliability and durability at extreme temperatures. The grand and long-term vision of this project is to develop light-weight, mechanically flexible, solution/melt-processed printed electronics that outrival their conventional inorganic based electronics at extreme conditions.
Document Details
- Document Type
- DoD Grant Award
- Publication Date
- Jan 23, 2019
- Source ID
- N000141912027
Entities
People
- Jianguo Mei
Organizations
- Office of Naval Research
- United States Navy
- University of Virginia