State-of-the-Art Flip-Chip Bonding System for Packaging of Optoelectronic Integrated Circuits
Abstract
PUBLICLY RELEASABLE ABSTRACTA major obstacle in achieving the ultimate performance of optoelectronic integrated circuits fabricated,using the facilities available at the University of New Mexicos (UNMs) Center for High Technology Materials is the lack of the state,-of-the-art equipment for connecting cleanroom-fabricated chips to external electrical interfaces via proper packaging. The package,protects the chip, and makes electrical signals accessible to measurement equipment.The main components of the proposed system are t,he SETNA ACCuRA100 high-accuracy flip-chip bonder, and the SETNA OntosTT 200-40 stand-alone atmospheric plasma instrument for surfac,e preparation of parts to be bonded. The latter instrument is especially important to achieve reliability of the flip-chip process w,ith indium, which oxidizes easily.Although the main application for the ACCuRA100 is flip-chip bonding, the machine can be used for,many other applications, including micro assembly, diode laser and laser bar place-ment, VCSELvertical-cavity surface-emitting laser, and photodiode placement, light-emitting diode placement, chip-to-chip and chip-to-substrate bonding, multi-chip module packaging,,3D packaging, microelectromechanical systems, micro-optoelectromechanical systems, and nanoimprinting (UV nanoimprint lithography an,d hot embossing). Apart from flip-chip bonding, the ACCuRA100 can also perform die bonding and pick-and-place bonding through thermo,compression, thermosonic, UV curing, or reflow processes. Bonding materials that can be used are gold, gold/tin, indium, copper, and, UV or thermally cured adhesives.This acquisition will significantly enhance UNMs capabilities to conduct research and to educate sc,ientists and engineers in the areas of integrated optoelectronics, microelectronics, and micro-electromechanical systems of critical, importance to national defense. The initial research will be on optoelectronic integrated circuits incorporating strongly injection,-locked microring lasers.Research enabled by the acquisition of the proposed equipment will provide the basis for new Ph.D. disserta,tions, M.S. theses, and Senior Design projects. Students involved in research projects using this equipment will either register for, graded research problems, or will include the project results in their theses/dissertations. Thus, the valuable training and experi,ence they gain by participating in the projects will have an additional educational dimension by contributing directly to their degr,ee programs. The estimated useful life of the proposed system is 20 years, with the expected total number of students using it for t,heir research exceeding 300.
Document Details
- Document Type
- DoD Grant Award
- Publication Date
- Nov 04, 2022
- Source ID
- N000142312027
Entities
People
- Marek Osinski
Organizations
- Office of Naval Research
- United States Navy
- University of New Mexico