Scaleup of high temperature polyimide and polyolefin dielectrics, film processing and testing
Abstract
The goal of this program is to scale-up melt processable polyimides discovered through previous Office of Naval Research MURI funded research. Specifically, polymerization of the relatively inexpensive monomer, benzophenotetracarboxylic dianhydride (BTDA) with either butylene diamine or propylene diamine results in films made from solution processing with Tg above 150 degrees C, dielectric constants of approximately 3.6, and bandgaps of approximately 3.4 eV. At a 4g scale, the yield of polyimide was 91%, purified to dielectric quality. Approximately 10-micron thick films yielded a breakdown of 812 MV/m according to Weibull distribution. Here, we plan to scale this polyimide from 4g to 5kg going through a 100g synthesis first. Polyimides will be purified by Soxhlet extraction, dried and shipped for both solution processing first, and then line melt processing. To enhance the thermal and breakdown properties, metal crosslinks will be introduced during solution processing and dielectric properties characterized and compared. Polyimide at the 5kg scale will be melt processed into films and then engineered to be approximately 10 to 15 micrometers in thickness. All films will be tested for breakdown under room temperature and elevated temperatures of up to temperatures of 150 degrees C.Approved for Public Release
Document Details
- Document Type
- DoD Grant Award
- Publication Date
- Apr 12, 2023
- Source ID
- N000142312348
Entities
People
- Gregory Sotzing
Organizations
- Office of Naval Research
- United States Navy
- University of Connecticut