High-Temperature Inorganic Thin Film Electrets for Partial Discharge Free High-Voltage Power Modules
Abstract
The global energy transition, including transportation electrification and renewable energy integration, requires high-voltage (HV)power electronic devices rated for 10 kV and above that can reliably operate at high-temperature and/or low-pressure environments. As power semiconductor technology continues to advance toward higher voltage levels and outpace electrical insulation materials and techniques, ensuring the dielectric integrity of power electronic devices and medium voltage (MV) distribution systems is becoming amore significant challenge. Studies have shown that recurring, steep voltage pulses induced by wide bandgap (WBG) devices operatingat high temperatures render existing dielectric materials and insulation coordination approaches ineffective, promote more significant and more frequent partial discharge (PD), degrade electrical insulators at a higher pace, and pose a greater risk to the modernizing grid and electrifying transportation systems. This project aims to develop electrets that can mitigate PD under recurring, steep electric transients caused by WBG and ultra-wide bandgap (UWBG) power semiconductors operating at high temperatures. The electretswill show high charge density and retention and perform throughout the life of power electronic devices. The PI will achieve the project goal by fabricating high-temperature electrets from amorphous and crystalline layers of inorganic thin films. Various types ofmultilayer thin film structures involving amorphous and crystalline layers will be investigated to achieve the best-performing high-temperature electret. Furthermore, the PI will investigate various methods to seamlessly incorporate the high-temperature thin filmelectrets into metalized ceramic substrates. Finally, the electrical and thermal performance of metalized ceramic substrates without the thin film electrets will be compared against those with the thin film electrets included as a packaging component. The expected outcome of this project is a novel packaging component that helps develop PD-free high HV power electronic devices. Developing newdielectric solutions tailored to the evolving electrical challenges based on innovative concepts and new materials, such as electrets, is essential for the Navy to successfully advance to the future generation of ships, operating on advanced power and energy systems that satisfy future Naval performance requirements.
Document Details
- Document Type
- DoD Grant Award
- Publication Date
- Jul 24, 2023
- Source ID
- N000142312673
Entities
People
- Chanyeop Park
Organizations
- Office of Naval Research
- United States Navy
- University of Wisconsin System