Offering Research for More Accurate Measurement of Power Electronics SiC Component Junction Temperature Under Multiple Operating Modes

Abstract

Approved for Public Release - Silicon Carbide MOSFETs present opportunities to significantly increase the efficiency, while decreasing the size and volume, of power electronic converters operating in electric ships, vehicles, and aircraft. Volume and weight constraints are strict in these applications. However, at present, these potential benefits are not fully utilized since SiC MOSFET devices are oversized to ensure that the junction temperature remains below the device maximum limits. This is due to a lack of reliablejunction temperature measurement methods. The junction temperature of a SiC MOSFET device is one of the primary design parameters in power electronic systems, but is currently not possible to measure during system operation. This project will review challenges in the current state-of-the-art for SiC MOSFET junction temperature measurement and thermal characterization. Following this, the project will investigate methods for junction temperature measurement in multi-chip SiC MOSFET power modules. These methods may include, but not limited to, technologies such as on-chip sensors, optical fibers, fiber bragg grating sensors, or infra-red measurements. The technologies will be assessed under a variety of criteria such as repeatability, noise immunity, accuracy, time response, calibration requirements, and feasibility for high voltage operation. The project aims to move these technologies from TRL 4 to TRL 7 and manufacture a series of prototype SiC MOSFET modules with a retrofitted multi-chip junction temperature measurement system. If successful, the results will provide a safe operating range for commercially available SiC power modules used in Navy applications. In addition, knowledge of junction temperature provided by this project may enable more responsive thermal protection during overload or pulsed power operations, and conditioned based monitoring to detect degraded modules, thermal systems, or controller performance in power electronic systems.

Document Details

Document Type
DoD Grant Award
Publication Date
Nov 08, 2024
Source ID
N000142412508

Entities

People

  • Nicholas Baker

Organizations

  • Office of Naval Research
  • United States Navy
  • University of Alabama

Tags

Fields of Study

  • Engineering

Readers

  • Electrical Engineering
  • Semiconductor Device Technology
  • Software Engineering

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems