DURIP Sample Preparation for IC Security Assessment
Abstract
As a result of advances in hardware security, the frontline of cybersecurity has advanced well beyond the realm of software and into the world of hardware implementations. Traditional software defenses are no longer effective against hardware-based attacks, and the hardware root-of-trust has become the final line of defense between adversaries and defenders. High-value targets, such as military electronic equipment for navigation, communications, and control, must be safeguarded against knowledgeable and capable adversaries of hardware security. Therefore, system-level vulnerabilities must be thoroughly evaluated at the hardware level. The hardware security analysis of an integrated circuit (IC) includes assessing power-based, electromagnetic (EM), and optical side-channel leakage, as well as evaluating tamper resistance, and power- and laser-based fault injection resistance. Additionally, due to the globalization of the electronics supply chain of ICs, Printed Circuit Board (PCB)s, and other subsystems, assessing the integrity and authenticity of new equipment is a crucial concern.To address this critical Department Of Defense (DOD) challenge in advanced IC technologies, this project proposes the acquisition of a precision milling and polishing machine. The milling system enhances access to the internal IC design by removing packaging and shielding, by thinning the substrate of flip-chip ICs with high precision, and by delayering the IC for full reverse engineering. This sample preparation supports optical and electrical analysis of the IC. Worcester Polytechnic Institute (WPI) has the know-how as well the test instrumentation to conduct advanced security analysis on ICs prepared in this manner. The proposed instrument will substantially enhance the capabilities in defensive and offensive hardware security researchand training, by supporting research in laser-based fault injection and countermeasures, research in laser-based voltage probing and countermeasures, research in hardware assurance and integrity through optical inspection and impedance analysis, and research in advanced EM emission side-channel attacks.The proposed instrument, an Allied X-Prep Precision Polishing System, is a specialized 5-axis CNC-based milling machine designed to support electrical and physical analysis requiring high-precision sample preparation. The milling machine will complement existing WPI testing equipment including a Hamamatsu PHEMOS-X IC inspection system, an Alphanov LaserFault Injection system, and a Riscure EM-based and power-based side-channel measurement and fault injection system. The proposed instrument significantly enhances the capabilities of the existing instrumentation to perform advanced hardware security analysis on new IC designs as well as on existing commercial of the shelf (COTS) components.The proposed instrument equipment is an important building block towards training and research in a reliable, secure IC design and testing flow for applications relevant to DOD missions. Several new and existing graduate-level courses in IC design and IC security analysis will integrate the instrument into hands-on labs. At the undergraduate level, the instrument will serve master qualifying project (MQP)s in hardware security. WPI will also offer professional training in hardware security to DOD and industrial partners.
Document Details
- Document Type
- DoD Grant Award
- Publication Date
- Nov 08, 2024
- Source ID
- N000142412543
Entities
People
- Patrick Schaumont
Organizations
- Office of Naval Research
- United States Navy
- Worcester Polytechnic Institute