NICOP - Solvents undergoing liquid/liquid phase separation in micro domains next generation fluids for direct chip level cooling
Abstract
It has long been realized that miniature heat sinks hold several key advantages over their large scale counterparts — much higher HTC, significantly larger surface area, elimination of thermal interfaces, and reduced thermal path from the heat sink to the electronic circuit. In recent years, DARPA initiated several programs to advance direct chip level cooling methods. The proposed work seeks to study and develop new heat transfer liquids with superior thermal properties for achieving high convective heat transfer rates in microchannels. The new coolants consist of partially miscible two (or three) component system that undergoes liquid-liquid phase separation (decomposition) via temperature change. The beneficial use of these coolants fits well within DARPA efforts. The suggested innovation is based on the prospects of using phase transition of liquid-liquid systems to enhance heat transfer rates [1, 9-13].
Document Details
- Document Type
- DoD Grant Award
- Publication Date
- Aug 12, 2016
- Source ID
- N629091512032
Entities
People
- Amos Ullmann
Organizations
- Office of Naval Research
- Tel Aviv University
- United States Navy