NICOP - Thermally Optimized Paradigm of thermal Management (TOPM)
Abstract
To appreciate the new paradigm we further elaborate on the role of thermal effects: The role of temperature in ULSI and VLSI chips and in state-of-the-art high power, mixed signals, and Systems on Chip (SoC) is well-established by now. When the level of power consumption becomes relatively high, a designer has to consider at the designing stage factors such as the decrease of the carrier mobility/conductance due to a rise in temperature, the lowering of the maximum saturation current, gain (Gm) reduction, and the increase in leakage currents and increase in device mismatch due to variation of the threshold voltage. In particular, in designing embedded systems based on mixed signal chips with high performance computing systems as well as a large number of analog and digital components, known as SoC, one has to give serious consideration to the effect of temperature.
Document Details
- Document Type
- DoD Grant Award
- Publication Date
- Aug 12, 2016
- Source ID
- N629091512033
Entities
People
- Yael Nemirovsky
Organizations
- Office of Naval Research
- United States Navy