Multi-Scale Materials Modeling Centers
Abstract
This Project supports two competitively awarded Collaborative Research Alliances (CRAs) to provide the Army with next generation multi-functional materials for ballistic and electronic applications and to address the extreme challenges associated with understanding and modeling materials subject to Army operational environments. The Materials in Extreme Dynamic Environments consortium, led by Johns Hopkins University partnered with CalTech, Rutgers University, and University of Delaware, focuses on understanding materials under high strain rates. The Multiscale Multidisciplinary Modeling of Electronic Materials consortium, led by University of Utah partnered with Boston University and Rensselaer Polytechnic Institute, focuses on microscale properties to design macroscale behavior for electronics. Research at both CRAs will address the modeling and experimental challenges associated with developing multidisciplinary physics simulations across multiple length scales for materials to include: a limited ability to relate materials chemistry, structure, and defects to materials response and failure under extreme conditions; an inadequate ability to predict the roles of materials structure, processing, and properties on performance in relevant extreme environments and designs; and the lack of experimental capabilities to quantify multiscale response and failure of materials under extreme conditions. Work in this Project supports key Army needs and is coordinated with work performed in PE 0601102A (Defense Research Sciences) / Project H44 (Adv Sensor Research) and H42 (Materials and Mechanics). FY20 realignments are due to financial restructuring in support of Army Modernization Priorities The cited work is consistent with the Under Secretary of Defense for Research and Engineering priority focus areas and the Army Modernization Strategy.
Document Details
- Document Type
- Project
- Publication Date
- Oct 01, 2021
- Source ID
- VS2_0601104A_1_2040_PB_2021