Dynamics of Crack-Interface Interaction in Layered Transparencies: An Experimental Investigation using Novel Optical Techniques (Research Area 1.2 Solid Mechanics)
Abstract
The objective of this proposal is to shed light on fracture mechanics of a dynamically growing crack interacting with normally placed interfaces to understand penetration, entrapment, and branching mechanisms. Augmenting energy dissipation by introducing interfaces of different strength at suitable location/sin the structure is among the objectives. Attenuation of stress waves in the presence of interfaces of different elastic characteristics will be examined as well. The project objectives will be accomplished by extending and developing full-field optical methods including Digital Gradient Sensing (DGS) technique recently introduced by the Pl. The PI will develop a hybrid method for evaluating spatial gradients of stress by combining with photoelastic methods capable of quantifying stress. If successful, this hybrid tool will provide a new experimental mechanics technique for stress measurement.
Document Details
- Document Type
- DoD Grant Award
- Publication Date
- Jan 12, 2017
- Source ID
- W911NF1610093
Entities
People
- Hareesh V. Tippur
Organizations
- Army Contracting Command
- Auburn University
- United States Army