Wafer bonding for hybrid photonic integration research
Abstract
The primary objective of this proposal is to create the wafer bonding capability at Clemson University to support several ongoing hybrid photonic integration related projects supported by the DoD. The requested funds will be used to purchase an EVG 500 wafer bonder. The requested equipment will also enable many other research projects in optoelectronics, microfluidics, plasmonics, and biophotonics. Other users of the equipment include more than ten faculty members from ECE, Materials, Physics, Chemistry, and BioEng at Clemson. Equally important is education. If funded, this project will provide many interdisciplinary opportunities to educate and train undergraduate and graduate students in photonic integration. In particular, students will be able to fabricate and characterize micro/nanoscale optoelectronic devices and gain hands-on research experiences. Hybrid photonic integration of active and passive components in different material systems has attracted intense interests in order to create next generation multifunctional photonic integrated circuits. The main motivation is to realize each desired photonic function by using the best suitable material and create the whole system based on hybrid integration. Wafer bonding is a technology to join two substrate materials with different structural properties. Combining different material systems through wafer bonding can overcome the limitation of a conventional single material system, such as silicon or IIIV semiconductors. Thus, exploring new material platforms through wafer bonding for hybrid photonic integration has become a driving force to realize novel complex and multifunctional photonic devices. The requested equipment will greatly enhance our fabrication capacities in the area of hybrid photonic integration. The proposed education activities include interdisciplinary research for graduate students, creative inquiry for undergraduate students, and new curriculum in micro/nano fabrication.
Document Details
- Document Type
- DoD Grant Award
- Publication Date
- Oct 16, 2018
- Source ID
- W911NF1710283
Entities
People
- Zhu Lin
Organizations
- Army Contracting Command
- Clemson University
- United States Army