E-beam Sub-micron Lithography System for Integrated UVC Applications
Abstract
This request for $131.18K from University of South Carolina is to purchase e-beam lithography attachment and control boards to enable e-beam lithography capability with the existing Supra 25 Scanning Electron Microscope. There are several military and commercial application systems that require solar blind focal plane arrays for threat imaging applications. Such solid-state detector arrays can inherently be integrated with read-out electronics thereby providing a true monolithic solution for Ultraviolet Ð C (UVC) imaging applications that include missile detection, non-line of sight communication and nuclear radiation detection. Our group has demonstrated solar blind UV sensors using AlxGa1-xN (x>0.4) pn-junctions and optical transistors. The reported pixel sizes were in excess of (100 µm x100 µm). Through the past and current ARO supported programs (ARO Contract Number: W911NF-18-1-0029, Program Manager M. Gerhold), we have also demonstrated micro-pixel UVC LEDs with more than 20 µm diameter. In addition, we also demonstrated UVC displays with a matrix electronic control of these UVC LEDs. All these demonstrations were based on large area devices fabricated using a Karl Suss contact lithography system. A large number of critical applications of monolithically integrated UVC imaging sensors require sub-micrometer and nano-meter size features. We believe that combining the knowledge base from these past efforts, we can fabricate UVC imaging sensors. These detectors will be capable of integration with AlGaN based electronic elements such as a heterojunction-field-effect- transistor. To the best of our knowledge there have been no reports of UVC detector arrays with sub-micron pixel sizes. A key requirement for achieving these imaging micro-pixel UVC sensor arrays is the capability to do processing (lithography, etching, selective area growth) at the sub-micron level. Currently at USC we have a Supra 25 Field Emission SEM system. We request $131.18K to upgrade the boards and acquire a Raith Elphy Plus Nanolithography attachment capable of resolution below 200nm, while minimizing line edge roughness for photonic devices, such as (tapered) waveguide and X-ray optics.. Such a capability will also enable us to fabricate sub-micron pixel UVC Focal Plane Array (FPA) arrays for UVC sensing, imaging and non-line of sight communication applications.
Document Details
- Document Type
- DoD Grant Award
- Publication Date
- Jul 09, 2020
- Source ID
- W911NF2010180
Entities
People
- Asif Khan
Organizations
- Army Contracting Command
- United States Army
- University of South Carolina