Atomic Layer Deposition Tool for High Power Density and Reliability with Nanoscale Devices
Abstract
Reduction in size and weight of power modules is a key technology driver for ONR. Discrete power modules of today feature large size and weight because each component is individually packaged at low power density and assembled to perform the system functions. ONRÕs aggressive approach to advance integrated power electronics building block (iPEBB) topologies and operating frequencies has led to major SWaP-C improvements. However, more advances in capacitors, magnetics and high-density 3D packaging with embedded components are needed to meet the future needs. Traditional materials and processes do not offer quantum leaps in performance to meet these targets. Innovative nanoarchitectures with metastable materials that meet the performance and reliability metrics are the key to meet the metrics. Such materials and structures should be deposited with controlled composition and structures at nanoscale to meet properties such as Permittivity, Breakdown Strength, Electrical and Thermal Conductivity but also in the required architectures to achieve the volumetric density. ALD (Atomic Layer Deposition) enables fundamental advances in material and process technologies to meet the future needs. Specifically, it has the ability to form nanoscale dielectric and conductor films with the required permittivity, conductivity, defect-free quality, conformal deposition on complex geometries and ability to manipulate interfacial chemistries through precise control of process parameters. We propose to utilize ALD to develop a variety of system components and interfaces with systematic basic research in the deposition of high-permittivity oxide dielectrics and nitride conductors in thin-film, nanoporous and multilayered architectures. We request funds to support the acquisition of a leading-edge ALD tool. With this augmented infrastructure at FIU, we will investigate process, material chemistry and interfacial design to achieve superior performance metrics and system reliability. The basic research with the proposed ALD tool will be customized to ONRÕs needs: a) high-density and high-energy charge storage: nanoscale capacitors that support kV operation and MHz frequencies with low parasitics and high current-handling, along with supercapacitors with high volumetric density to form thin embedded components. b) inorganic coatings with superior hermetic barrier properties: inorganic barriers that are nanoscale and yet achieve vapor transmission rates of thick metal and ceramic barriers, c) Low-stress, high-conductivity copper-graphene die-attach and heat-spreader materials for packaging of wide bandgap GaN and SiC devices, d) Dielectrics for Vacuum FETs and THz Devices: Inorganic films for emitters, detectors and intelligent reflective surfaces, e)Low-impedance electrodes, f)Organic semiconductor templating and other applications. The tool will be added to the Motorola Nanofabrication Research Facility at the FIU EC Building, which is also shared with external users. The tool enables research advances that seamlessly cuts across all engineering disciplines. By offering advanced nanofabrication tools that incorporate the ALD materials and processes, the tool will also serve as the bridge to educate next-generation workforce on nanotechnologies for bioelectronic and electronic system integration, with specific emphasis on nanoscale components, interfacial engineering and fundamentals of film growth processes. The associated metrology tool (Woollam Ellipsometer) will enable characterization of nanometer-thick films and improve the process control capabilities to yield precise nanoscale devices. The funding will augment the acquisition of nanoelectronics cluster tools at FIU. Future outreach programs at FIU that are related to STEM Engineer on Wheels, RET, ROTC, diversity workforce development and others will immensely benefit from this tool.
Document Details
- Document Type
- DoD Grant Award
- Publication Date
- Aug 02, 2022
- Source ID
- W911NF2210147
Entities
People
- Markondeyaraj Pulugurtha
Organizations
- Army Contracting Command
- Florida International University
- Office of the Secretary of Defense