Dynamic and Reconfigurable Electronic Materials
Abstract
Conventional hard electronics and emerging soft electronics each have their unique advantages and application space. Combining them into a single entity that can reversibly switch between soft and hard states in response to the environment or usage needs can open doors a plethora of new opportunities. Such transformative behavior is uncommon in solid-state materials, but is the defining characteristics of several classes of dynamic fluids. Some examples include, shear-thickening fluids, the omagic ingredientÓ behind the liquid armor technology, can stiffen rapidly in the presence of impact, and magnetorheological and electrorheological fluids with incrementally tunable viscosity in the presence of magnetic or electric field. Most importantly, owing to their fluid nature, these soft/hard transitions are highly reversible. Unfortunately, fluids are often harmful to electronics, making their direct integration challenging. Our proposed work aims to solve this fundamental dichotomy by encapsulating dynamic fluids into microscopic capsules (Aim 1). The solid exterior of the fluid droplets allow them to be directly integrated with virtually any electronic materials, hence endowing them with the sought-after dynamic properties (Aim 2). This drastically enhanced processability also paves the way for dynamic fluids to become 3D printable, which in turn produces new properties arisen from hierarchical complexity and architectural design (Aim 3). In particular, we plan to further toughen these dynamic electronic materials through programmable biomimetic assembly (Aim 3(a)), and to make them lower in density without compromising strength by exploring design concepts behind mechanical metamaterials (Aim 3(b)). Through all these endeavors, special attention will be paid to retaining the high conductivity of the target materials so that their electrical performance does not come as a compromise of the remarkable mechanical and dynamic characteristics. Significance and impact: Successful execution of our proposed activities will produce unprecedented combination of properties for electronic materials: reversible soft/hard tunability and reconfigurability that are adaptive to the environment or usage needs, along with toughening, impact-resistant, and self-protective properties. These characteristics will improve the durability, reliability, and mobility of electronic devices, and as a result, enhance the safety and mobility of soldiers. Furthermore, all our proposed approaches are general. While the immediate focus of this proposal is on electrically conductive materials, the governing design principles developed here are widely applicable to other functional materials, including semiconductors and photonic materials, potentially creating an ensemble of smart, adaptable, and self-protective devices for army-relevant applications.
Document Details
- Document Type
- DoD Grant Award
- Publication Date
- Jul 27, 2023
- Source ID
- W911NF2310261
Entities
People
- Yue Jessica Wang
Organizations
- Army Contracting Command
- United States Army
- University of California