IntraChip Enhanced Cooling (ICECool)
Abstract
The IntraChip Enhanced Cooling (ICECool) program incorporated thermal management techniques directly into microelectronics. This enabled operation of military electronic systems at higher powers while significantly reducing their size and weight. Today, the high-power operation of military electronics is restricted by the amount of heat created. ICECool overcame these limitations by significantly increasing the rate of heat removal in microelectronics. Areas of focus included overcoming the limits of existing thermal management techniques, determining the feasibility of exploiting these techniques within a single chip or stack of chips, and ensuring the reliable operation of microelectronics that produce high levels of heat. ICECool integrated chip-level thermal management techniques into prototype, high-power electronics in radio frequency arrays and embedded computing systems. Successful program completion will meet the capability needs of next-generation military systems, enabling increased radar range, improved target tracking, and accelerated processing using high power computing.
Document Details
- Document Type
- Accomplishment
- Publication Date
- Oct 01, 2018
- Source ID
- a449cbb6c92d2e1f2db57d0664b16d66
Related Documents
- Root: ELECTRONICS TECHNOLOGY