Address DoD Unique Needs - Radiation Hardening and non-CMOS - Demonstration
Abstract
Government-unique trusted design and manufacturing flows have been developed to enable a tier of trust for select ASIC parts; however, this approach addresses only a small subset of DoD microelectronics requirements (e.g., processors, memory, microcontrollers, field programmable gate arrays (FPGAs), and radiation-tolerant processors). The DoD will partner with the intelligence community, the Department of Energy, and the National Aeronautics and Space Administration to demonstrate radiation hardened components that permit systems to operate in space and other harsh environments. State-of-the-practice (SOTP) and SOTA technologies will be characterized and developed in support of Radiation Hardened By Process (RHBP) and Radiation Hardened By Design (RHBD) activities in support the DoD modernization programs with radiation hardened requirements. A similar situation exists for radio frequency and optical applications. These two applications reflect only a small market with unique costs and specifications, which does not inherently create incentive for industrial investment. Within RF and opto-electronics, investments will be made in RF GaN and integrated photonic material sources, foundries, and packaging facilities in order to enable low-size, weight, and power devices which broadly access the millimeter wave spectrum, while providing high-bandwidth data transmission.
Document Details
- Document Type
- Accomplishment
- Publication Date
- Oct 01, 2024
- Source ID
- a95a2a9225e775ad7206c237d7bd3912