Advanced RF Packaging

Abstract

Advanced Electronics Manufacturing: This effort will apply an existing radar system already in production to satisfy a low-cost, open-architecture radar requirement for the Littoral Combat Ship (LCS) program. This program will reduce the cost of the current radar system by ~20% and fit into the existing TRS-3D top side and below decks available footprint. The open architecture configuration will allow upgrades for new technologies over the lifetime of the program as well as offer lower cost via open competition for the radar’s building blocks. Finally, the plastic packaging effort as a part of this program will have a direct impact on the Volume Search Radar (VSR) on CVN-79 – creating an additional $1M/hull cost savings for the Navy (a total of $51M). Manufacturing technology improvements will have a direct impact on the rate and quantity of this capability delivered to current operations. This effort will provide the Navy with the first truly open architecture radar solution that will be able to accommodate different MMIC technologies, Line Replaceable Unit (LRU) technologies, processor, and power supplies from multiple vendors. The system will use fiber optics to enhance radar performance, resulting in faster antenna rotation rates (enabling more exposure of targets) and greater flexibility in location of below-desks equipment (allowing a lower center of gravity and thus improved ship stability).

Document Details

Document Type
Accomplishment
Publication Date
Oct 01, 2013
Source ID
abc5bab5206257b9d93110159b063c3d

Tags

Fields of Study

  • Engineering

Readers

  • Industrial Economics
  • Integrated Circuit Design and Technology.
  • Naval Mine Countermeasure Systems Development.

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems

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