Next Generation Microelectronics Prototyping - Designs
Abstract
Next Generation Microelectronics Prototyping - Designs supports the development of novel three-dimensional heterogeneous integration (3DHI) capable of being prototyped using the National Network for Next-generation Microelectronics Manufacture (N3M2). The N3M2 will include public-private partnerships that provide the ability to manufacture prototypes of next-generation 3DHI microsystems, including fabrication, packaging, assembly, and testing. The design challenges provide the opportunity to explore approaches that will improve and accelerate the adoption of 3DHI standardized chip-to-chip interfaces and package optimization. Leading-edge chip designs will be fabricated, and subsequently integrated into 3DHI designs in multi-project demonstration runs. Research related to this effort is funded within PE 0603739E, Project MT-16.
Document Details
- Document Type
- Accomplishment
- Publication Date
- Oct 01, 2024
- Source ID
- ac82ceb7fdcf0bd3a4c2ee3c2751643d
Related Documents
- Root: ELECTRONICS TECHNOLOGY