Minitherms3D*

Abstract

* Previously part of Next Generation Microelectronics - 3DHI Minitherms3D will develop thermal management solutions for the three-dimensional heterogeneous integration (3DHI) of microelectronics, to accelerate the growth of compact, high high-performance microsystems. 3DHI microsystems are enabling for phased array systems, and for dense computing for on artificial intelligence / machine learning applications. Minitherms3D will reduce the size, weight and power (SWaP) of high high-performance 3DHI microsystems by developing new methods to remove heat from within the 3D stack, transmit it further away to the outer boundaries of the stack, and reject it to outside the ambient environment.

Document Details

Document Type
Accomplishment
Publication Date
Oct 01, 2024
Source ID
ae7797c593b6785da8d34587dd2d56ae

Tags

Readers

  • Electrical Engineering
  • Integrated Circuit Design and Technology.

Technology Areas

  • AI & ML
  • Microelectronics
  • Microelectronics - Graphene

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