Artemis
Abstract
Artemis develops and demonstrates a sensor package optimized for high-altitude operations. These multi-mode sensors are packaged to minimize size and power requirements, and to protect electronics from environmental interference. Design of the sensor package initiated in FY 2022, with a demonstration of the sensor package during stratospheric flight planned for FY 2024, prior to transition to the U.S. Army for qualification testing.
Document Details
- Document Type
- Accomplishment
- Publication Date
- Oct 01, 2024
- Source ID
- aedcb9529d2e9975b8dd11782440c677