Access to Advanced Packaging and Testing - Development
Abstract
This project will leverage heterogeneous integrated (HI) packaging technologies to accelerate adoption of the most advanced microelectronics available. Key technologies, processes and tools will be developed and improved upon, allowing DoD to utilize HI technologies to package chips and chiplets (small specialized die) to realize performance benefits. Working with world-class industrial partners will provide early access to proprietary information related to these technologies, giving DoD an asymmetrical advantage. This project will deliver an on-shore microelectronic device package design, assembly, and test capability. It will provide access to dual-use SOTA heterogeneous packaged microelectronics and manufacturing processes. It will enable Description: This project will utilize Description: This project will utilize Description: This project will leverage heterogeneous integrated (HI) packaging technologies to accelerate adoption of the most advanced microelectronics available. Key technologies, processes and tools will be developed and improved upon, allowing DoD to utilize HI technologies to package chips and chiplets (small specialized die) to realize performance benefits. Working with world-class industrial partners will provide early access to proprietary information related to these technologies, giving DoD an asymmetrical advantage. This project will deliver an on-shore microelectronic device package design, assembly, and test capability. It will provide access to dual-use SOTA heterogeneous packaged microelectronics and manufacturing processes. It will enable personalization of, and customization for supporting DoD programs. It will enable a revolutionary leap in system performance that will greatly reduce size, weight and power (SWaP) by incorporating the immense advances in SOTA commercial off the shelf (COTS) processing technologies, such as field programmable gate arrays (FPGAs), microprocessors, and Graphic Processing Units (GPUs).
Document Details
- Document Type
- Accomplishment
- Publication Date
- Oct 01, 2025
- Source ID
- b790bac7fdead6dc9b91cc90a98ce973