MAJOR THRUST: Develop technologies for space-based payload components such as radiation-hardened electronic devices, micro-electro-mechanical system devices, and advanced electronics packaging.

Document Details

Document Type
Accomplishment
Publication Date
Oct 01, 2011
Source ID
bc2a97627840e945f31e1ad15fa6fd2b

Tags

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems
  • Space

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