Vehicle Electronics Integration Technologies:
Abstract
This effort matures, demonstrates and implements next generation military ground vehicle electronics and electrical power open architectures for future ground combat and tactical vehicle systems. Mature and demonstrate technologies to include: next generation video/data networking and computing equipment, Silicon Carbide (SiC) high voltage power electronics and low voltage smart power distribution. Technologies will reduce currently fielded vehicle overall size, weight and power (SWaP) concerns for vehicle electronics. This effort is coordinated with efforts in Program Element (PE) 0602601A.
Document Details
- Document Type
- Accomplishment
- Publication Date
- Oct 01, 2019
- Source ID
- be7b195022a823f952235889ee43158c