NextFlex Manufacturing Innovation Institute (Flexible Hybrid Electronics Manufacturing)
Abstract
Flexible hybrid electronics manufacturing involves highly tailorable devices on non-traditional, compliant substrates that combine thinned components manufactured from traditional processes with components that are added via “printing” processes. This institute will invest in prototyping and scale-up of manufacturing processes for high speed pick-and-place, printed circuits, and hybrid fabrication that will enable defense and commercial applications in wearable electronics, unattended sensors and integrated array antennas, medical devices and soft robotics devices, and the continuous improvement in SWAPC (Size, Weight And Power plus Cost) for electronic systems.
Document Details
- Document Type
- Accomplishment
- Publication Date
- Oct 01, 2021
- Source ID
- c4a001bb83d6beb7f5e7cf71c5d0967e