Diverse & Accessible Heterogeneous Integration (DAHI)
Abstract
The Diverse Accessible Heterogeneous Integration (DAHI) program developed the design and manufacturing capabilities required to seamlessly integrate various semiconductors, microelectromechanical systems, photonic (light-manipulating) devices, and thermal management structures into true systems-on-a-chip (SOC). This capability enabled dramatic size, weight, and volume reductions and higher performance for DoD electronic warfare, communications, and radar systems. Historically, chip designers had to decide between the availability, development, and low cost of silicon circuits or the high performance of compound semiconductor (CS) materials. DAHI, however, built on previous DARPA and commercial efforts, which demonstrated that heterogeneously integrating CS and silicon can yield significant performance improvements over silicon or CS alone. DAHI's applied research program focused on developing and demonstrating high-performance SOC for DoD-specific applications. The program also enhanced the manufacturing yield and reliability of heterogeneous integration capabilities and demonstrated innovative, advanced microsystems that leveraged heterogeneous integration. Relevant manufacturing processes were made available to a wide variety of designers from the DoD laboratories, federally funded research and development centers, academia, and industry. This program had advanced technology development efforts funded in PE 0603739E, Project MT-15.
Document Details
- Document Type
- Accomplishment
- Publication Date
- Oct 01, 2019
- Source ID
- cdab85bde21ec5cea1deca10d17af3b1
Related Documents
- Root: ELECTRONICS TECHNOLOGY