Power Electronic Components and Materials
Abstract
This effort investigates, designs, and develops electric conversion technologies to reduce size and weight while increasing performance and capabilities to support current and future mission loads and provide improved military vehicle mobility. Research focuses on semiconductor power switches, power switch modules/packaging, and power switch module thermal management. Investigation of high voltage/high frequency power semiconductor materials and devices is concentrated on efficient power switching under militarily relevant temperatures. Design and development of multi-disciplinary parametric design optimization software tools and multi-functional package structures provides advances in device packaging technology to fully realize device performance improvements. Results of the research inform 0602145A BH5 Platform Electrification and Mobility Tech.
Document Details
- Document Type
- Accomplishment
- Publication Date
- Oct 01, 2024
- Source ID
- cdfeb0c287262770555a52015462c2d8
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