Beyond Scaling - Materials
Abstract
The Beyond Scaling - Materials program demonstrated the integration of novel materials into next-generation logic and memory components. This program pursued potential enhancements in electronics that do not rely on Moore's Law, i.e., silicon transistor scaling, including research into new materials and the implications of those materials at the device, algorithm, and packaging levels. Research areas included heterogeneous integration of multiple materials, "sticky logic", and novel transistor devices that combine elements of computation and memory with three-dimensional vertical circuit integration to demonstrate dramatic performance improvements using older silicon technologies. Basic research for this program was funded within PE 0601101E, Project ES-02.
Document Details
- Document Type
- Accomplishment
- Publication Date
- Oct 01, 2024
- Source ID
- cfeb27a0547e30995196b77197a4596c
Related Documents
- Root: ELECTRONICS TECHNOLOGY