Package on Package Technology for ARC-210 Radio (Navy)

Abstract

Package on Package (POP) technology is three dimensional stacking of two or more Ball Grid Array (BGA) microelectronic packages that enables increased capabilities and functionalities in limited space. This technology will allow continued growth in tactical communication capabilities for vehicles while reducing weight and power consumption. Improving the expandability of the ARC-210 radio within its current configuration will additionally eliminate the need for expensive aircraft system integration efforts. The primary outputs and efficiencies to be demonstrated in the project are: (1) increased interoperability and mission flexibility; and (2) avoids RDT&E and Operations and Support costs worth almost $4.500 million.

Document Details

Document Type
Accomplishment
Publication Date
Oct 01, 2011
Source ID
d093f35b9eabe256b5abf721e285e624

Tags

Readers

  • Integrated Circuit Design and Technology.
  • Naval Mine Countermeasure Systems Development.
  • Software Engineering

Technology Areas

  • Microelectronics
  • Space

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