Thermal Management Technologies (TMT)
Abstract
The goal of the Thermal Management Technologies (TMT) program is to explore and optimize new nanostructured materials and other recent advances for use in thermal management systems. Innovative research is underway to go beyond evolutionary thermal management systems. Modern, high-performance heat spreaders, which use two-phase cooling, are being developed to replace the copper alloy spreaders in conventional systems. Enhancing air-cooled exchangers by reducing the thermal resistance through the heat sink to the ambient, increasing convection through the system, improving heat sink fin thermal conductivity, optimizing and/or redesigning the complimentary heat sink blower, and increasing the overall system (heat sink and blower) coefficient of performance is another thrust of this program. Another element of this effort is focused on novel materials and structures that can provide significant reductions in the thermal resistance of the thermal interface layer between the backside of an electronic device and the next layer of the package, which might be a spreader or a heat sink. The TMT program is an aggregation of: Thermal Ground Plane (TGP), Microtechnologies for Air-Cooled Exchangers (MACE), Nano Thermal Interfaces (NTI) and Active Cooling Modules (ACM) technology research. Technology will be inserted through DoD industrial firms into future DoD systems.
Document Details
- Document Type
- Accomplishment
- Publication Date
- Oct 01, 2012
- Source ID
- d42a9675c56bdda29c770fed75e1baf3