Applique Technologies for TDLs
Abstract
This effort will develop and test low Size, Weight, and Power (SWaP) applique production kits to support TDL communications; it will incorporate proven techniques related to RF components, system interfaces, and platform integration. This effort will identify appropriate platforms, apertures, and interfaces and evaluate using representative flight environments and conditions.
Document Details
- Document Type
- Accomplishment
- Publication Date
- Oct 01, 2019
- Source ID
- d49fde07f4a974c2db1b20bbe0224c46