Next Generation Microelectronics - Advanced Manufacturing for Extreme Environment Electronics
Abstract
Next Generation Microelectronics - Advanced Manufacturing for Extreme Environment Electronics addresses the design, fabrication, packaging, assembly, testing, and digital emulation of the next generation of microsystems targeted for use in extreme environments: high voltage, high current, high temperature, low temperature, and radiation exposure. New manufacturing methods along with new testing and evaluation methods will be created, with an emphasis on developing techniques to enable in-situ measurements of these microsystems while operating in the extreme environments. These new manufacturing methods will also focus on a higher degree of automation in the packaging, assembly, and testing processes. This effort will also develop techniques to significantly improve thermal management, inter-chip power delivery, package integrity, and the modeling and simulation of these unique microsystems. Basic research related to this effort is funded within PE 0601101E, Project ES-02.
Document Details
- Document Type
- Accomplishment
- Publication Date
- Oct 01, 2024
- Source ID
- d4ba79d9f8872d428c473c7d8c9d7f5a
Related Documents
- Root: ELECTRONICS TECHNOLOGY