Electronic Globalization
Abstract
Approximately 66% of all installed semiconductor wafer capacity is in Asia. This creates a significant risk for the DoD as off-shore manufacturing of microelectronic components could introduce various vulnerabilities to DoD systems that utilize these non-U.S. fabricated electronic components. As the DoD is faced with this globalization reality, it is essential to prevent potential consequences such as reverse engineering, and the theft of U.S. intellectual property. New applied research technology enablement will be developed in the Electronics Globalization program to provide a means of assessing the impact of high stress upon Government Off-The-Shelf (GOTS) and Commercial Off-The-Shelf (COTS) components produced in conventional contemporary foundries. The potential application of these components in extreme stresses DoD systems and makes it even more important to understand the new physics mechanisms to be expected in these regimes. The extendibility of existing reliability models, and the calibration of new reliability models for components operated outside of typical use conditions will be studied. Further, the insight gained from understanding these impacts will inform the use of elevated stress burn-in and screening tools, potentially allowing shorter and more effective test times in the fabrication plant.
Document Details
- Document Type
- Accomplishment
- Publication Date
- Oct 01, 2017
- Source ID
- d78a484b62ae6ab49c11c7b610dce8dc