Electronic Globalization
Abstract
Approximately 66% of all installed semiconductor wafer capacity is in Asia. This creates a significant risk as off-shore manufacturing of microelectronic components could introduce various vulnerabilities to DoD systems that utilize these non-U.S. fabricated electronic components. As the DoD is faced with this globalization reality, it is essential to prevent potential consequences such as reverse engineering, theft of U.S. intellectual property, and non-authorized use of these electronic components in adversary defense systems. The Electronic Globalization program will examine various approaches for trusting circuits in an untrusted environment. It will develop the abilities to design circuits with functionality that is benign in an untrusted environment. Basic Research activity will focus on the characterization of materials and structures which enable the trust of circuitry. This trust will be provided by the ability to create back end of line processing, or other similar mechanisms, to complete or personalize a circuit after it has been through the majority of the traditional supply chain. Applied research for the program is budgeted in PE 0602303E, Project IT-02.
Document Details
- Document Type
- Accomplishment
- Publication Date
- Oct 01, 2016
- Source ID
- d913dd6c4a4c82af9fd2a88442f198df