Beyond Scaling - Materials
Abstract
The Beyond Scaling - Materials program will demonstrate the integration of novel materials into next-generation logic and memory components. Historically, the DoD had taken the lead in shaping the electronics field through research in semiconductor materials, circuits, and processors. However, as DoD focuses on military-specific components and commercial investments eschew the semiconductor space, U.S. fundamental electronics research is stagnant just as an inflection point in Moore's Law (silicon scaling) is about to occur. This program will pursue potential enhancements in electronics that do not rely on Moore's Law, including research not only into new materials but also into the implications of those materials at the device, algorithm, and packaging levels. Research areas will include heterogeneous integration of multiple materials, "sticky logic" devices that combine elements of computation and memory, and leveraging three-dimensional vertical circuit integration to demonstrate dramatic performance improvements with older silicon technologies. The program aims to demonstrate the manufacturability of functioning switches, memory, and novel computational units in a large-scale system. Previous DARPA work on unconventional computing, integration, and reprogrammable memory give confidence in this approach. Basic research for this program is funded within PE 0601101E, Project ES-01.
Document Details
- Document Type
- Accomplishment
- Publication Date
- Oct 01, 2018
- Source ID
- dc602dd4057d285a8ea5a537f11c001f
Related Documents
- Root: ELECTRONICS TECHNOLOGY