Electronics Processing and Fabrication
Abstract
The primary technical goal of the Electronics Processing and Fabrication activity is improving electronic weapon systems affordability by developing and transitioning affordable, robust manufacturing processes and capabilities for electronics critical to defense applications over their full life-cycle. Efforts create new and improved electronics/electro-optics manufacturing processes for transition to the production floor. Emphasis is on affordability for the following platforms: VIRGINIA Class Submarine (VCS)/COLUMBIA Class Submarine (CLB), DDG 51 Class Destroyer, CVN 78 Class Carrier, Joint Strike Fighter (JSF), and CH-53K Heavy Lift Helicopter. Electronics processing and fabrication technology areas include but are not limited to Electronics manufacturing technology (materials, devices, circuits, modules, subsystems); Semiconductor devices/vacuum electronics/passive components; compound semiconductors/wide bandgap semiconductors; low-cost, high-throughput manufacturing and assembly techniques; nanoelectronics; electronics packaging technologies (including tamper proof and non-hermetic approaches); optics manufacturing technology (materials devices, circuits, modules, subsystems); optical interconnects; fiber optics and photonics; technologies for electronics and electro-optics testing and evaluation; optical imaging for manufacturing operations; and directed energy weapons.
Document Details
- Document Type
- Accomplishment
- Publication Date
- Oct 01, 2020
- Source ID
- dd4c72212904c1edbf6a68dc2e15df4c