IntraChip Enhanced Cooling (ICECool)
Abstract
The IntraChip Enhanced Cooling program is exploring disruptive technologies that will remove thermal barriers to the operation of military electronic systems, while significantly reducing size, weight, and power consumption. These thermal barriers will be removed by integrating thermal management into the chip, substrate, or package technology. Successful completion of this program will close the gap between chip-level heat generation density and system-level heat removal density in RF arrays and embedded computers. Specific areas of focus in this program include overcoming limiting evaporative and diffusive thermal transport mechanisms at the micro/nano scale to provide an order-of-magnitude increase in on-chip heat flux and heat removal density , determining the feasibility of exploiting these mechanisms for intrachip thermal management, characterizing the performance limits and physics-of-failure of high heat density, intrachip cooling technologies, and integrating chip-level thermal management techniques into prototype high power electronics in the form factor of RF arrays and embedded computing systems.
Document Details
- Document Type
- Accomplishment
- Publication Date
- Oct 01, 2014
- Source ID
- e88b8d64642169b6d190dc8a64c93d6d
Related Documents
- Root: ELECTRONICS TECHNOLOGY