System-On-Chip (SOC)
Abstract
Enable smaller, less costly Global Positioning Systems (GPS) for artillery platforms by developing the manufacturing technologies to enable reduced weight, size and power consumption to provide leap-ahead communication and sensor capability by maturing technologies that move heavy, high volume/power demand systems to small, power efficient System-On-Chip (SOC) packaging technology. Program Outputs: Move the basic packaging technology from Manufacturing Readiness Level (MRL) 3 to qualification for application in the Ground-Based GPS Receiver Application Module (GB-GRAM) 105mm Smart artillery round (PKG II) as the initial adopter. Defense Wide Manufacturing S&T investments will refine the fabrication process, develop design rules for complex integration of non-optimized mixed devices on same silicon, and accelerate the development and integration of the transmit and receive module that can be used for downstream system application.
Document Details
- Document Type
- Accomplishment
- Publication Date
- Oct 01, 2011
- Source ID
- ebf7714269f50f613c1de586ac1e338a