Chip-to-Chip Optical Interconnects (C2OI)
Abstract
(U)Continuing advances in integrated circuit technology are expected to push the clock rates of Complimentary Metal-Oxide Semiconductor (CMOS) chips into the 10 gigahertz (GHz) range over the next four to six years. At the same time, copper-based technologies for implementing large number of high-speed channels for routing these signals on a printed circuit board and back planes are expected to run into fundamental difficulties. This performance gap in the on-chip and between-chip interconnection technology will create data throughput bottlenecks affecting military-critical sensor signal processing systems. To address this pressing issue, this program is developing optical technology for implementing chip-to-chip interconnects at the board and back plane level.
Document Details
- Document Type
- Accomplishment
- Publication Date
- Oct 01, 2011
- Source ID
- fc06866b2a6199bf5da2b3445c122bf8
Related Documents
- Root: ELECTRONICS TECHNOLOGY