Trusted and Assured Microelectronics
Abstract
This Program Element (PE) supports microelectronics modernization activities that enable defense systems to keep pace with commercial microelectronics technological advances, reduce reliance on obsolete microelectronics, and mitigate the Department’s reliance on sole source foundries for assured state-of-the-art (SOTA) microelectronics. It addresses the challenges of 1) having enduring access to a multiplicity of modern manufacturing processes that require commercial volumes to maintain long term viability and 2) protecting the intellectual property (IP) of the microelectronic parts that are manufactured. This PE supports the National Defense Strategy’s (NDS) for 2018 line of effort to build a more lethal force through modernization of key capabilities, the NDS defense objective of establishing an unmatched twenty-first century National Security Innovation Base that effectively supports Department operations and sustains security and solvency, and the NDS strategic approach of reforming the Department’s business practices by simultaneously increasing performance and affordability while still minimizing risk. This PE supports the OUSD(R&E) Microelectronics Modernization Roadmap. The primary areas of focus of this roadmap include the following: access to state-of-the-art microelectronics technology, access to advanced packaging and test; access to the best commercial design technology; quantifiable assurance and secure design; foundry access; policies, standards, and Joint Federated Assurance Center (JFAC) governing body; access to radiation hardened microelectronics; access to non-complementary metal oxide semiconductor state-of-the-art (SOTA) microelectronics for radio frequency and optoelectronic applications; education and workforce development; and supply chain awareness and security. Recognizing that an assured supply of microelectronics is a U.S. Government (USG)-wide concern, this activity will interface with interagency partners to take into account interagency requirements, opportunities for collaboration, and strategic decisions that can be made to limit the overall cost of these requirements to the USG. This activity is being led by the Under Secretary of Defense for Research and Engineering.
Document Details
- Document Type
- R2 Budgetary Justification
- Publication Date
- Oct 01, 2023
- Source ID
- 0604294D8Z_4_0400_PB_2023
- Change Summary Explanation
- A Congressional rescission of $14.451 million was enacted as part of the FY 2022 Appropriation reducing the available FY 2021 budget to $474.800 million. FY 2022 Appropriation increased in the amount of $196.500 million for the following efforts: o $18.000 million - radiation-hardened fully-depleted silicon-on insulator microelectronics o $25.000 million - GaN and GaAs RFIC technology o $43.500 million - advanced node radiation-hardened fully depleted silicon-on-insulator technology o $10.000 million - trusted artificial intelligence o $100.000 million - design acceleration FY 2023 funding increase reflects the fact that the FY 2022 President’s Budget request did not include out-year funding. The FY 2023 funding request was reduced by $25.430 million to account for the availability of prior year execution balances.
- Service Agency Name
- Office of the Secretary Of Defense
Entities
Organizations
- Office of the Secretary of Defense
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