Trusted and Assured Microelectronics
Abstract
This Program Element (PE) supports microelectronics modernization activities that enable defense systems to keep pace with commercial microelectronics technological advances, reduce reliance on obsolete microelectronics, and mitigate the Department’s reliance on sole source foundries for assured state-of-the-art (SOTA) microelectronics. It addresses the challenges of 1) having enduring access to a multiplicity of modern manufacturing processes that require commercial volumes to maintain long term viability and 2) protecting the intellectual property (IP) of the microelectronic parts that are manufactured. This PE supports the 2018 National Defense Strategy’s (NDS) line of effort to build a more lethal force through modernization of key capabilities, the NDS defense objective of establishing an unmatched twenty-first century National Security Innovation Base that effectively supports Department operations and sustains security and solvency, and the NDS strategic approach of reforming the Department’s business practices by simultaneously increasing performance and affordability while still minimizing risk. This PE supports the OUSD(R&E) Microelectronics Modernization Roadmap. The primary areas of focus of this roadmap include the following: access to advanced packaging and test; quantifiable assurance and secure design; foundry access; verification and validation; policies, standards, and Joint Federated Assurance Center (JFAC) governing body; access to radiation hardened microelectronics; access to non-complementary metal oxide semiconductor (CMOS) SOTA microelectronics; disruptive research and development; education and workforce development; trusted foundry and obsolescence; and supply chain awareness and security. Recognizing that an assured supply of microelectronics is a U.S. Government (USG)-wide concern, this activity will interface with interagency partners to take into account interagency requirements, opportunities for collaboration, and strategic decisions that can be made to limit the overall cost of these requirements to the USG. This activity is being led by the Under Secretary of Defense for Research and Engineering.
Document Details
- Document Type
- R2 Budgetary Justification
- Publication Date
- Oct 01, 2021
- Source ID
- 0605294D8Z_5_0400_PB_2021
- Change Summary Explanation
- In FY 2021, Project 812 "Trusted Mask” will be eliminated. Project 809 “New Trust Demonstration” and Project 822 “Microelectronics Innovation for National Security and Economic Competitiveness (MINSEC)” activities will be re-aligned under three new project codes to correctly align Program Element (PE) funding in support of a zero-trust philosophy and reflective of current priorities. The new project codes are: (1) P902 Access to State-of-the-Art (SOTA) Microelectronics - Demonstration; (2) P903 Access to Advanced Packaging and Testing - Demonstration; and (3) P905 Address DoD Unique Needs Especially Radiation Hardening - Demonstration. In FY 2021, $41.250 million was added to support enhanced and assured microelectronics design, domestic manufacturing capability, including heterogeneous integration and low volume applications, and a proactive awareness and security effort to identify and mitigate critical microelectronics supply chain threats.
- Service Agency Name
- Office of the Secretary Of Defense
Entities
Organizations
- Office of the Secretary of Defense
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