Microelectronics Innovation for National Security and Economic Competitiveness (MINSEC) Enhancement and Demonstration
Abstract
This project supports the DoD microelectronics strategy by ensuring the availability of and access to the advanced, assured microelectronics that are critical for DoD and national security systems. It will deliver tools to protect the IP confidentiality and integrity for a broad range of systems and missions and will provide a path for the production of these articles. This project supports a broader national strategy to focus resources, policies, and incentives to enhance current and next generation defense capability by: 1) maintaining access to U.S. domestic production of state-of-the-art (SOTA) technology; 2) enabling solutions for DoD heterogeneous integration and advanced packaging needs; 3) leveraging commercial technology through demonstrations with industry of dual-use technologies with built in assurance, and incentivizing stronger commercial engagement through piloting acquisition reforms and providing incentives for cooperative R&D and trade; 4) enhancing state-of-the-practice (SOTP) foundries in the U.S. to produce more advanced technologies to better serve low-volume customers in the aerospace and defense community; 5) accelerating the transition and capture of the next generation of microelectronics through commercial partnerships and lowering domestic barriers to innovation in coordination with the Defense Advanced Research Projects Agency (DARPA) Electronics Resurgence Initiative (ERI); and 6) promoting threat awareness, proactive protection, and supply chain security to ensure these investments continue to benefit the U.S. MINSEC activities are categorized into the following focus areas: access to specialized SOTA and dual use microelectronics technology, collection and analysis of data for metrics driven quantifiable assurance, maintaining and enhancing U.S capability though capture and secure, and transition of next generation microelectronics technology including demonstration and capability insertion; microelectronics-focused workforce training; radiation hardening by process (RHBP) and radiation hardening by design (RHBD) in advanced technology nodes for next-generation strategic systems; and radio frequency (RF) and optoelectronic (OE) microelectronics.
Document Details
- Document Type
- Project
- Publication Date
- Oct 01, 2021
- Source ID
- 822_0605294D8Z_5_0400_PB_2021
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- Root: Trusted and Assured Microelectronics
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- Child Cost Item: 8d8584c7839b2c6cf76331c3059a9b3b