Technologies for Rapid Assembly of Microsystems (TRAM)
Abstract
The Technologies for Rapid Assembly of Microsystems (TRAM) program will develop technology to assemble heterogeneous electronics modules with high performance that can be readily inserted into DoD modules, arrays, and systems. Current low-volume assembly of heterogeneous electronics is time-intensive, expensive, and offers varying levels of performance and state-of-the-art packaging capability that is increasingly dominated by foreign industry and driven by commercial needs and volumes. Low-volume, domestic assembly of high-performance electronics is needed to preserve capability and security of DoD systems. In order to enable new electronics capabilities that can be readily transitioned into prototypes and systems, TRAM will develop technologies for desktop assembly and packaging of different electronics technologies to rapidly move them from design to systems.
Document Details
- Document Type
- Accomplishment
- Publication Date
- Oct 01, 2023
- Source ID
- 40bd6434c7c69a2c86cdb06cbd9abbae
Related Documents
- Root: ELECTRONICS TECHNOLOGY